شرکت افق الکترونیک افتخار دارد بر پایه بیش از ۱۵ سال سابقه فنی و بازرگانی در ارتباط با صنعت الکترونیک نیازهای حرفه ای متخصصین در زمینه بردهای مدار چاپی (برد الکترونیکی ) HIGH TECH تا 50 لایه با متریال های خاص و تخصصی با کاربرد های مختلف (فرکانس بالا؛ فلکسی بل ؛ آلومینیوم و …) را در زمان بسیار کوتاه با قیمتهای رقابتی برآورده سازد.
1- تولید بردهای مدارچاپی 2 تا 40 لایه بدون محدودیت در حجم سفارش
2- تولید برد مدارچاپی با متریال های: ROGERS, TACONIC, RF, CEM, FR4, FLEXIBLE
3- تولید بردهای مدارچاپی BLIND/BURIED وایا
4- تولید بردهای RIGIDFLEX, Aluminium Base
Seq |
Process |
Item |
Unit |
Process Capability |
|
|
1 |
Basic Information |
Surface |
Surface Treatment |
Tin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard Gold |
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2 |
Selective Surface Treatment |
ENIG+OSP,ENIG+Gold Finger,Flash Gold+HASL,Flash Gold+Gold Finger,Immersion Silver+Gold Finger,Immersion Tin+Gold Finger |
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3 |
Products Capabiity |
Layer Count |
Layer |
1-30(≥14 Layers needs Review) |
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4 |
Bow and Twist |
% |
0.7(≤0.5needs Process Review) |
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5 |
Min finished size |
mm |
10*10 |
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6 |
Max finished Size (4L) |
inch |
22.5*33.5(Needs Review If length exceeds 30 Inch) |
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7 |
Max finished Size (≥6L) |
inch |
22.5*26.5(Needs Review If length exceeds 22.5 Inch) |
|||
8 |
Multi-press for Blind/Buried Vias |
/ |
Multi-press Cycle≤3 times(Needs review for 2 cycles pressing) |
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9 |
Max finished Size (Double Sides) |
inch |
23*35(Needs Review If length exceeds 30 Inch) |
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10 |
Finished Board Thickness |
mm |
0.20-7.0(≤0.2mm Needs Review),≤0.4mm for HASL |
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11 |
Finished Board Thickness Tolerance(≤1.0mm) |
mm |
±0.1 |
|||
12 |
Finished Board Thickness Tolerance(>1.0mm) |
mm |
Material Thickness±10% |
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13 |
Unspecified Finished Board Thickness Tolerance(No stack up requirements) |
mm |
Multilayer:≤2.0mm can±0.1;2.0-3.0mm can±0.15;≥3.0mm can±0.2;Double Sides+/-10% |
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14 |
Reliable Test |
Peel Strength |
N/cm |
7.8 |
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15 |
Flammability |
94V-0 |
||||
16 |
Ionic Contamination |
ug/cm2 |
≤1 |
|||
17 |
Min Dielectric Thickness |
mm |
0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80% |
|||
18 |
Impedance Tolerance |
% |
±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%(Needs Review) |
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19 |
Base Material Type |
Material Type |
High Tg Material |
Shengyi Tg>170℃, Lianmao Tg>170℃ |
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20 |
Impedance Control Material |
Others need Review |
FR-4,FR-4 HighTg Series |
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21 |
RCC Material |
Needs Review |
Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um) |
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22 |
Others |
Rogers, Isola, Taconic , Arlon |
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23 |
Prepreg Type |
FR-4 Prepreg、LD-1080(HDI) |
7628 2116 1080 3313 106 |
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24 |
Copper foil |
Copper Foil |
um |
12、18、35、70、105(Use 70UM base copper,After plating 105UM) |
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25 |
Innerlayer & Outerlayer Image Transfer |
Machine |
Scrubbing Machine |
0.11-3.2mm,min 9*9inch |
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26 |
Innerlayer Process Capability |
laminator, Exposer |
0.11-6.0mm,min 8*8in,max 24*24in |
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27 |
Etching Line |
0.11-6.0mm,min 7*7inch |
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28 |
Min Inner Line Width(18um copper foil,Before Compensation) |
mil |
4(3.5mil needs review) |
|||
29 |
Min Inner Line Spacing(18um base copper,after compensation) |
mil |
3.5 |
|||
30 |
Min Inner Line Width(35um copper foil,Before Compensation) |
mil |
4(3.5mil needs review) |
|||
31 |
Min Inner Line Spacing(35um base copper,after compensation) |
mil |
3.5 |
|||
32 |
Min Inner Line Width(70um copper foil,Before Compensation) |
mil |
5 |
|||
33 |
Min Inner Line Spacing(70um base copper,after compensation) |
mil |
6(5mils needs review) |
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34 |
Min Inner Line Width(105um copper foil,Before Compensation) |
mil |
6 |
|||
35 |
Min Inner Line Spacing(105um base copper,after compensation) |
mil |
7(6mils needs review) |
|||
36 |
Min Inner Line Width(140um copper foil,Before Compensation) |
mil |
7 |
|||
37 |
Min Inner Line Spacing(140um base copper,after compensation) |
mil |
8(7mils needs review) |
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38 |
Min Spacing from hole edge to conductive |
mil |
≤6L 8mil(Partial 7mil)、≤18L 10mil(Partial 9mil)、≥20L 12mil(Partial 11mil) |
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39 |
Innerlayer & Outerlayer Image Transfer |
Innerlayer Process Capability |
Min Innerlayer Annular Ring |
mil |
4(18um,35um,Partial3.5),6(70um),8(105um) |
|
40 |
Min Innerlayer Isolation Clearance |
mil |
Conductive to Conductive 10mil(Partial 8mil) |
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41 |
Min Spacing from board edge to conductive |
mil |
8(except for blind vias)、10(Blind Vias) |
|||
42 |
Min Gap width between copper ground |
5(35um base copper) ≥2pcs (≥70um needs review) |
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43 |
Different copper thckness for inner core |
18/35,35/70(needs review) |
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44 |
Max Finished Copper Thickness |
5OZ(175um)、≥3OZ needs review |
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45 |
Outlayer Process Capability |
Min Outer Line Width(12/18um base copper,before compensation) |
mil |
4(18um),3.5(12um),3MIL line width can't process flash gold |
||
46 |
Min Outer Line Spacing(12/18um base copper, after compensation) |
mil |
4.0(18um),3.5(12um)(3.5MIL needs review) |
|||
47 |
Min Outer Line Width(35um base copper,before compensation) |
mil |
4.0 |
|||
48 |
Min Outer Line Spacing(35um base copper, after compensation) |
mil |
4(3.5mil suggest to use 12um base coper) |
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49 |
Min Outer Line Width(70um base copper,before compensation) |
mil |
6.0 |
|||
50 |
Min Outer Line Spacing(70um base copper, after compensation) |
mil |
6.0(5.0MIL needs review) |
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51 |
Spacing from Line to pad, pad to pad (After compensation) |
mil |
3.5(12um),4.0(18um、35um),5.5(70um),6.5(105、140um) |
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52 |
Min Outer Line Width(105um base copper,before compensation) |
mil |
7.0 |
|||
53 |
Min Outer Line Spacing(105um base copper, after compensation) |
mil |
7.0 |
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54 |
Min Outer Line Width(140um base copper,before compensation) |
mil |
8.0 |
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55 |
Min Outer Line Spacing(140um base copper, after compensation) |
mil |
7.0 |
|||
56 |
Min Grid Line Width |
mil |
5(12、18、35 um),10(70 um) |
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57 |
Min Grid Spacing |
mil |
5(12、18、35 um),8(70 um) |
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58 |
Min Hole Pad Diameter |
mil |
12(0.10mm mechanical or Laser Drill) |
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59 |
Innerlayer & Outerlayer Image Transfer |
Process Capability |
Max size for slot tenting |
5mm*3.0mm;the tent land should >10mil |
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60 |
Max diameter for tenting hole |
mm |
4.5 |
|||
61 |
Min tent land width |
mil |
8 |
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62 |
Min annular ring(after compensation, except for blind vias) |
mil |
4(12、18um) Partial 3.5、4.5(35um)、 6(70um)、8(105um)、10(140um) |
|||
63 |
Min BGA diamter |
mil |
10(Flash gold 8mil) |
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64 |
AOI |
Machine Capability |
Orbotech SK-75 AOI |
/ |
0.05-6.0mm,max 23.5*23.5inch |
|
Orbotech Ves Machine |
/ |
0.05-6.0mm,max 23.5*23.5inch |
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66 |
Drilling |
Machine Capability |
MT-CNC2600 Drill machine |
can process 2nd drill |
0.11-6.0mm,max 18.5*26inch ¢0.20MM钻刀 |
|
67 |
Process Capability |
Min Multi-hit drill bit size |
mm |
0.55 |
||
68 |
Max aspect ratio for board thickness vs drill bit size |
/ |
12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review) |
|||
69 |
Hole location tolerance(Compare with CAD data) |
mil |
±3 |
|||
70 |
Counterbore hole |
PTH & NPTH,Top angle 130 Degree,Top diameter <6.3mm |
||||
71 |
Min spacing from hole edge to conductive(Except for blind vias) |
mil |
6(≤8 L),8(≤14 L),12(≤26 L) |
|||
72 |
Max drill bit size |
mm |
6.5 |
|||
73 |
Max board thickness for 0.20mm drill bit size |
mm |
2.5 |
|||
74 |
Min multi-hit slot width |
mm |
0.45 |
|||
75 |
Hole size tolerance for press fit |
mil |
±2 |
|||
76 |
Min PTH Slot dimension tolerance |
mm |
±0.15 |
|||
77 |
Min NPTH slot dimension tolerance |
mm |
±2(min +0,-0.05 or +0.05,-0) |
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78 |
Drilling |
Process Capability |
Min spacing from hole edge to conductive(Blind vias) |
mil |
9(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing) |
|
79 |
Max board thickness for 0.15mm mechanical drill |
mm |
1.20(≤8 L) needs review |
|||
81 |
Min hole size for laser drill |
mm |
0.10(Depth ≤55um),0.13(Depth ≤80um,0.15(Depth ≤100um) |
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82 |
Countersink hole angle & Diameter |
Top 82,90,120 degree, diameter≤10mm needs review |
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83 |
Wet Process |
Machine Capability |
Panel & Pattern plating line |
0.20-7.0mm,max 24*30inch |
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84 |
Deburring Maching |
0.20-7.0mm,min 8*8inch |
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85 |
Desmear Line |
Can process 2nd desmear |
0.20-7.0mm,max 24*32in |
|||
86 |
Tin Plating Line |
0.20-3.2mm,max 24*30inch |
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87 |
Process Capability |
Min hole wall copper thickness |
um |
average 25, min≥20 |
||
88 |
Finished copper thickness(18um base copper) |
um |
≥35(nominal thickness 52um、or 1.5Oz) |
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89 |
Finished copper thickness(35um base copper) |
um |
≥55(nominal thickness 65um) |
|||
90 |
Finished copper thickness(70um base copper) |
um |
≥90 |
|||
91 |
Min Line width for ectching marking |
mil |
8(12、18um),10(35um),12(70um) |
|||
92 |
Max finished copper thickness for inner & Outer layers |
/ |
5OZ(175um)、≥3OZ needs review |
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93 |
Different copper thickness |
/ |
18/35、35/70(needs review) |
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94 |
Solder Mask |
Machine Capability |
Scrubbing Machine |
/ |
0.50-7.0mm,min:9*9inch |
|
95 |
Exposer |
/ |
0.11-7.0mm,max 25*32inch |
|||
96 |
Develop Machine |
/ |
0.11-7.0mm,min 4*5inch |
|||
97 |
Color |
Solder Mask Color |
/ |
Green, yellow, black, blue, red, white, matte green |
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98 |
Solder Mask |
Color |
Component Mark Color |
/ |
White、Yellow、Black |
|
99 |
Solder Mask Capability |
Min Solder Mask Opening(Clearance)(After Compensation) |
mil |
2(Partial 1.5 for Flash Gold,others can partia 1)Only for18um & 35um |
||
100 |
Max plugged vias size |
mm |
0.65mm for drill bit size |
|||
101 |
Min width for line coverage by S/M |
mil |
2mil per side,Only applies to 18um and 35um base copper |
|||
102 |
Min solder mask legends width |
mil |
8(min 7mil) |
|||
103 |
Min solder mask thickness |
um |
10 |
|||
104 |
Solder mask thickness for via tenting |
um |
10 |
|||
105 |
Min Spacing from carbon pattern to pads |
mil |
10mil、70um base copper≥12mil |
|||
106 |
Min width for peelable mask cover line/pads |
mil |
6 |
|||
107 |
Min solder mask bridge width |
mil |
Base copper≤1OZ,Black,white & matte ink are 6mils, other inks are 4mils. Base coper 2-4OZ, min bridge width is 6mils. |
|||
108 |
Solder Mask Hardness |
H |
6 |
|||
109 |
Solder Mask |
Peelable Mask Capability |
Min spacing from peelable mask pattern to pads |
mil |
12 |
|
110 |
Max diameter for peelable mask tent hole (By screen printing) |
mm |
2 |
|||
111 |
Max diameter for peelable mask tent hole (By Aluminum printing) |
mm |
4.5 |
|||
112 |
Peelable mask thickness |
mm |
0.2-0.5 |
|||
113 |
Component Mark Capability |
Min Component mark line width and height(12、18um base copper) |
/ |
Line width 4.5mil;Height:23mil |
||
114 |
Min Component mark line width and height(35um Base copper) |
/ |
Line width 5mil;Height:27mil |
|||
115 |
Min Component mark line width and height(≥70um Base copper) |
/ |
Line width 6mil, Height:45mil (State double printing on Lot Card) |
|||
116 |
Min Spacing from legends to pads |
mil |
7 |
|||
117 |
Surface Treatment |
Surface Treatment Capability |
Max Gold Finger Length |
inch |
2 |
|
118 |
Nickel Thickness For ENIG |
um |
3-5UM |
|||
119 |
Gold Thickness For ENIG |
um |
0.025-0.10 |
|||
120 |
Nickel Thickness For Gold Finger |
um |
3-5UM |
|||
121 |
Gold Thickness For Gold Finger |
um |
0.25-1.3 |
|||
122 |
Min Tin Thickness For HASL |
um |
0.4(Copper Ground) |
|||
123 |
HASL Machine |
Can process 2nd HASL |
0.6-4.0mm,min 5*5;max 20*25inch |
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124 |
Gold Finger surface treatment |
Flash Gold/ENIG;Flash Gold/Hard Gold |
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125 |
Immersion Gold |
0.2-7.0mm,min 6*6in,max 21*27in |
||||
126 |
Immersion Tin Thickness |
um |
0.8-1.5 |
|||
127 |
Immersion Silver Thickness |
um |
0.1-0.3 |
|||
128 |
OSP |
um |
0.1-0.3 |
|||
129 |
E-Test |
Machine Capability |
Flying Probe Tester |
0.4-6.0mm, max 19.6*23.5inch |
||
130 |
Min Spacing From Test Pad to Board Edge |
mm |
0.5 |
|||
131 |
Min Conductive Resistance |
Ω |
10 |
|||
132 |
Max Insulation Resistance |
MΩ |
100 |
|||
133 |
Max Test Voltage |
V |
500 |
|||
134 |
Min Test Pad Diameter |
mil |
3.9 |
|||
135 |
Min Test Pad to Pad Spacing |
mil |
3.9 |
|||
136 |
Max Test Current |
mA |
200 |
|||
136 |
Profiling |
Machine Capability |
Profiling Type |
/ |
NC Routing;V-CUT;Slot Tabs;Stamp Hole |
|
137 |
NC Routing Machine |
Can process 2nd Routing |
0.05-7.0mm,max 25.5*21.5inch |
|||
138 |
V-CUT Machine |
<0.8mm for one side only |
0.6-3.0mm, Max board width for v-cut:18inch |
|||
139 |
Min Routing Bit Diameter |
mm |
0.6 |
|||
140 |
Outline Tolerance(Line to Line) |
mil |
±4(Complicated outline、slot need review) |
|||
141 |
V-CUT Angle Type |
20°,30°,45°, 60° |
||||
142 |
Process Capability |
V-CUT Angle Tolerance |
o |
±5° |
||
143 |
V-CUT Registration Tolerance |
mil |
±4 |
|||
144 |
V-CUT Web Thickness Tolerance |
mil |
±4 |
|||
145 |
Min Gold Finger Spacing(After Compensation) |
mil |
6 |
|||
146 |
Min Spacing to avoid gold finger tab bevelled |
mm |
7(For Auto-Bevelling) |
|||
147 |
Bevelling Angle Tolerance |
/ |
±5° |
|||
148 |
Bevelling Remain Thickness Tolerance |
mil |
±5 |
|||
149 |
Min Inner Radius |
mm |
0.4 |
|||
150 |
Min Spacing from Conductive to Outline |
mil |
8 |
|||
151 |
Countersink or Counterbore Depth Tolerance |
mm |
±0.10 |