Seq

Process

Item

Unit

Process Capability

1

Basic Information

Surface

Surface Treatment

Tin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard Gold

2

Selective Surface Treatment

ENIG+OSP，ENIG+Gold Finger，Flash Gold+HASL，Flash Gold+Gold Finger，Immersion Silver+Gold Finger，Immersion Tin+Gold Finger

3

Products Capabiity

Layer Count

Layer

1-30(≥14 Layers needs Review）

4

Bow and Twist

%

0.7(≤0.5needs Process Review）

5

Min finished size

mm

10*10

6

Max finished Size (4L)

inch

22.5*33.5(Needs Review If length exceeds 30 Inch)

7

Max finished Size (≥6L)

inch

22.5*26.5(Needs Review If length exceeds 22.5 Inch)

8

Multi-press for Blind/Buried Vias

/

Multi-press Cycle≤3 times(Needs review for 2 cycles pressing)

9

Max finished Size (Double Sides)

inch

23*35(Needs Review If length exceeds 30 Inch)

10

Finished Board Thickness

mm

0.20-7.0(≤0.2mm Needs Review),≤0.4mm for HASL

11

Finished Board Thickness Tolerance(≤1.0mm)

mm

±0.1

12

Finished Board Thickness Tolerance(>1.0mm)

mm

Material Thickness±10%

13

Unspecified Finished Board Thickness Tolerance（No stack up requirements）

mm

Multilayer：≤2.0mm can±0.1；2.0-3.0mm can±0.15；≥3.0mm can±0.2；Double Sides+/-10%

14

Reliable Test

Peel Strength

N/cm

7.8

15

Flammability

94V-0

16

Ionic Contamination

ug/cm2

≤1

17

Min Dielectric Thickness

mm

0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80%

18

Impedance Tolerance

%

±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%（Needs Review）

19

Base Material Type

Material Type

High Tg Material

Shengyi Tg>170℃, Lianmao Tg>170℃

20

Impedance Control Material

Others need Review

FR-4,FR-4 HighTg Series

21

RCC Material

Needs Review

Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um)

22

Others

Rogers, Isola, Taconic , Arlon

23

Prepreg Type

FR-4 Prepreg、LD-1080（HDI）

7628 2116 1080 3313 106

24

Copper foil

Copper Foil

um

12、18、35、70、105（Use 70UM base copper，After plating 105UM）

25

Innerlayer & Outerlayer Image Transfer

Machine

Scrubbing Machine

0.11-3.2mm,min 9*9inch

26

Innerlayer Process Capability

laminator, Exposer

0.11-6.0mm,min 8*8in,max 24*24in

27

Etching Line

0.11-6.0mm,min 7*7inch

28

Min Inner Line Width(18um copper foil,Before Compensation)

mil

4（3.5mil needs review）

29

Min Inner Line Spacing(18um base copper,after compensation)

mil

3.5

30

Min Inner Line Width(35um copper foil,Before Compensation)

mil

4（3.5mil needs review）

31

Min Inner Line Spacing(35um base copper,after compensation)

mil

3.5

32

Min Inner Line Width(70um copper foil,Before Compensation)

mil

5

33

Min Inner Line Spacing(70um base copper,after compensation)

mil

6（5mils needs review）

34

Min Inner Line Width(105um copper foil,Before Compensation)

mil

6

35

Min Inner Line Spacing(105um base copper,after compensation)

mil

7（6mils needs review）

36

Min Inner Line Width(140um copper foil,Before Compensation)

mil

7

37

Min Inner Line Spacing(140um base copper,after compensation)

mil

8（7mils needs review）

38

Min Spacing from hole edge to conductive

mil

≤6L 8mil（Partial 7mil）、≤18L  10mil（Partial 9mil)、≥20L   12mil(Partial 11mil)

39

Innerlayer & Outerlayer Image Transfer

Innerlayer Process Capability

Min Innerlayer Annular Ring

mil

4(18um,35um,Partial3.5),6(70um),8(105um)

40

Min Innerlayer Isolation Clearance

mil

Conductive to Conductive 10mil(Partial 8mil)

41

Min Spacing from board edge to conductive

mil

8（except for blind vias）、10（Blind Vias）

42

Min Gap width between copper ground

5(35um base copper) ≥2pcs （≥70um needs review)

43

Different copper thckness for inner core

18/35,35/70(needs review）

44

Max Finished Copper Thickness

5OZ(175um)、≥3OZ needs review

45

Outlayer Process Capability

Min Outer Line Width(12/18um base copper，before compensation)

mil

4(18um),3.5(12um)，3MIL line width can't process flash gold

46

Min Outer Line Spacing(12/18um base copper, after compensation)

mil

4.0(18um),3.5(12um)（3.5MIL needs review)

47

Min Outer Line Width(35um base copper，before compensation)

mil

4.0

48

Min Outer Line Spacing(35um base copper, after compensation)

mil

4（3.5mil suggest to use 12um base coper）

49

Min Outer Line Width(70um base copper，before compensation)

mil

6.0

50

Min Outer Line Spacing(70um base copper, after compensation)

mil

6.0（5.0MIL needs review）

51

Spacing from Line to pad, pad to pad (After compensation)

mil

3.5(12um)，4.0(18um、35um),5.5(70um),6.5(105、140um)

52

Min Outer Line Width(105um base copper，before compensation)

mil

7.0

53

Min Outer Line Spacing(105um base copper, after compensation)

mil

7.0

54

Min Outer Line Width(140um base copper，before compensation)

mil

8.0

55

Min Outer Line Spacing(140um base copper, after compensation)

mil

7.0

56

Min Grid Line Width

mil

5（12、18、35 um），10（70 um）

57

Min Grid Spacing

mil

5（12、18、35 um），8（70 um）

58

Min Hole Pad Diameter

mil

12(0.10mm mechanical or Laser Drill)

59

Innerlayer & Outerlayer Image Transfer

Process Capability

Max size for slot tenting

5mm*3.0mm；the tent land should >10mil

60

Max diameter for tenting hole

mm

4.5

61

Min tent land width

mil

8

62

Min annular ring（after compensation, except for blind vias）

mil

4(12、18um) Partial 3.5、4.5(35um)、          6(70um)、8(105um)、10（140um）

63

Min BGA diamter

mil

10(Flash gold 8mil)

64

AOI

Machine Capability

Orbotech SK-75  AOI

/

0.05-6.0mm,max 23.5*23.5inch

Orbotech  Ves Machine

/

0.05-6.0mm,max 23.5*23.5inch

66

Drilling

Machine Capability

MT-CNC2600 Drill machine

can process 2nd drill

0.11-6.0mm，max 18.5*26inch   ￠0.20MM钻刀

67

Process Capability

Min Multi-hit drill bit size

mm

0.55

68

Max aspect ratio for board thickness vs drill bit size

/

12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review)

69

Hole location tolerance（Compare with CAD data）

mil

±3

70

Counterbore hole

PTH & NPTH，Top angle 130 Degree，Top diameter <6.3mm

71

Min spacing from hole edge to conductive(Except for blind vias)

mil

6(≤8 L),8(≤14 L),12(≤26 L)

72

Max drill bit size

mm

6.5

73

Max board thickness for 0.20mm drill bit size

mm

2.5

74

Min multi-hit slot width

mm

0.45

75

Hole size tolerance for press fit

mil

±2

76

Min PTH Slot dimension tolerance

mm

±0.15

77

Min NPTH slot dimension tolerance

mm

±2(min +0，-0.05 or +0.05，-0)

78

Drilling

Process Capability

Min spacing from hole edge to conductive(Blind vias)

mil

9(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing)

79

Max board thickness for 0.15mm mechanical drill

mm

1.20(≤8 L) needs review

81

Min hole size for laser drill

mm

0.10(Depth ≤55um),0.13(Depth ≤80um，0.15(Depth ≤100um)

82

Countersink hole angle & Diameter

Top 82，90，120 degree， diameter≤10mm needs review

83

Wet Process

Machine Capability

Panel & Pattern plating line

0.20-7.0mm,max 24*30inch

84

Deburring Maching

0.20-7.0mm,min 8*8inch

85

Desmear Line

Can process 2nd desmear

0.20-7.0mm,max 24*32in

86

Tin Plating Line

0.20-3.2mm,max 24*30inch

87

Process Capability

Min hole wall copper thickness

um

average 25, min≥20

88

Finished copper thickness(18um base copper)

um

≥35(nominal thickness 52um、or 1.5Oz)

89

Finished copper thickness(35um base copper)

um

≥55(nominal thickness 65um)

90

Finished copper thickness(70um base copper)

um

≥90

91

Min Line width for ectching marking

mil

8(12、18um)，10(35um)，12（70um）

92

Max finished copper thickness for inner & Outer layers

/

5OZ(175um)、≥3OZ needs review

93

Different copper thickness

/

18/35、35/70(needs review)

94

Solder Mask

Machine Capability

Scrubbing Machine

/

0.50-7.0mm,min：9*9inch

95

Exposer

/

0.11-7.0mm,max 25*32inch

96

Develop Machine

/

0.11-7.0mm,min 4*5inch

97

Color

Solder Mask Color

/

Green, yellow, black, blue, red, white, matte green

98

Solder Mask

Color

Component Mark Color

/

White、Yellow、Black

99

Solder Mask Capability

Min Solder Mask Opening（Clearance）(After Compensation)

mil

2(Partial 1.5 for Flash Gold,others can partia 1)Only for18um & 35um

100

Max plugged vias size

mm

0.65mm for drill bit size

101

Min width for line coverage by S/M

mil

2mil per side,Only applies to 18um and 35um base copper

102

Min solder mask legends width

mil

8(min 7mil)

103

Min solder mask thickness

um

10

104

Solder mask thickness for via tenting

um

10

105

Min Spacing from carbon pattern to pads

mil

10mil、70um base copper≥12mil

106

Min width for peelable mask cover line/pads

mil

6

107

Min solder mask bridge width

mil

Base copper≤1OZ，Black,white & matte ink are 6mils, other inks are 4mils. Base coper 2-4OZ, min bridge width is 6mils.

108

Solder Mask Hardness

H

6

109

Solder Mask

Peelable Mask Capability

Min spacing from peelable mask pattern to pads

mil

12

110

Max diameter for peelable mask tent hole (By screen printing)

mm

2

111

Max diameter for peelable mask tent hole (By Aluminum printing)

mm

4.5

112

Peelable mask thickness

mm

0.2-0.5

113

Component Mark Capability

Min Component mark line width and height(12、18um base copper)

/

Line width 4.5mil；Height：23mil

114

Min Component mark line width and height(35um Base copper)

/

Line width 5mil；Height：27mil

115

Min Component mark line width and height(≥70um Base copper)

/

Line width 6mil, Height:45mil (State double printing on Lot Card)

116

Min Spacing from legends to pads

mil

7

117

Surface Treatment

Surface Treatment Capability

Max Gold Finger Length

inch

2

118

Nickel Thickness For ENIG

um

3-5UM

119

Gold Thickness For ENIG

um

0.025-0.10

120

Nickel Thickness For Gold Finger

um

3-5UM

121

Gold Thickness For Gold Finger

um

0.25-1.3

122

Min Tin Thickness For HASL

um

0.4(Copper Ground)

123

HASL Machine

Can process 2nd HASL

0.6-4.0mm,min 5*5；max 20*25inch

124

Gold Finger surface treatment

Flash Gold/ENIG；Flash Gold/Hard Gold

125

Immersion Gold

0.2-7.0mm，min 6*6in，max 21*27in

126

Immersion Tin Thickness

um

0.8-1.5

127

Immersion Silver Thickness

um

0.1-0.3

128

OSP

um

0.1-0.3

129

E-Test

Machine Capability

Flying Probe Tester

0.4-6.0mm, max 19.6*23.5inch

130

Min Spacing From Test Pad to Board Edge

mm

0.5

131

Min Conductive Resistance

Ω

10

132

Max Insulation Resistance

MΩ

100

133

Max Test Voltage

V

500

134

Min Test Pad Diameter

mil

3.9

135

Min Test Pad to Pad Spacing

mil

3.9

136

Max Test Current

mA

200

136

Profiling

Machine Capability

Profiling Type

/

NC Routing；V-CUT；Slot Tabs；Stamp Hole

137

NC Routing Machine

Can process 2nd Routing

0.05-7.0mm,max 25.5*21.5inch

138

V-CUT Machine

<0.8mm for one side only

0.6-3.0mm, Max board width for v-cut:18inch

139

Min Routing Bit Diameter

mm

0.6

140

Outline Tolerance(Line to Line)

mil

±4(Complicated outline、slot need review)

141

V-CUT Angle Type

20°，30°，45°,  60°

142

Process Capability

V-CUT Angle Tolerance

o

±5°

143

V-CUT Registration Tolerance

mil

±4

144

V-CUT Web Thickness Tolerance

mil

±4

145

Min Gold Finger Spacing（After Compensation）

mil

6

146

Min Spacing to avoid gold finger tab bevelled

mm

7(For Auto-Bevelling)

147

Bevelling Angle Tolerance

/

±5°

148

Bevelling Remain Thickness Tolerance

mil

±5

149

Min Inner Radius

mm

0.4

150

Min Spacing from Conductive to Outline

mil

8

151

Countersink or Counterbore Depth Tolerance

mm

±0.10